Below you will find an overview of all events in the context of the The Netherlands & Taiwan Semiconductor Dialogue, which are still to take place or have already taken place.
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14 December 2021
Webinar: RF technology (Closed)
RF semiconductors are a fast growing market segment and are expected to amount 26.2 billion USD by 2025. The Netherlands is very strong in IC design for RF and this offers opportunities for business cooperation with the Taiwanese semiconductor industry. With this webinar we want to showcase Dutch RF strengths and its compatibility to the Taiwanese market. Join us and learn more about the Dutch and Taiwanese strengths in the field of RF, and lesser known success stories of Dutch Taiwanese cooperation within the semiconductor industry to enable a next generation of RF semiconductors.
Event details
Date webinar 'RF Technology': | 14 December |
Time: | 9:00-10:30 NL time / 16:00 – 17:30 TW time |
Moderator: | High-Tech NL |
Organizers: | NL Office Taipei, Taiwan, The Netherlands Enterprise Agency (RVO) High Tech NL /Holland Semiconductors, TSIA & SEMI Taiwan |
Presentations
The theme for this webinar will be ‘RF’ design, and 6 speakers from both Taiwan and the Netherlands will have about 10 minutes to introduce their RF strengths.
Speakers:
- University Twente , Professor Bram Nauta
- Mediatek, Jon Strange, Senior Director
- Bruco IC, Tim Tiek, CEO
- NTU, Professor Huang ,Tian-Wei
- Ampleon, Fred van Rijs, Fellow and Peter Stolk, Senior Vice President
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14 October 2021
Advanced Packaging Webinar (Closed)
Event details
Date 2nd webinar 'Advance packaging': | 14 October |
Time: | 9:30-10:30 NL time / 15:30 – 16:30 TW time |
Moderator: | Tom van der Dussen, Project Manager Holland Semiconductors |
Organizers | NL Office Taipei, Taiwan, The Netherlands Enterprise Agency (RVO) High Tech NL /Holland Semiconductors, SEMI Taiwan |
Presentations
The theme for this webinar will be ‘Advanced Packaging’. Advanced packaging is an increasingly more important topic because of the latest generation of even smaller chips, photonic ICs and 3D integrated chips. During our webinar we will give the floor to four keynote speakers from both Taiwan and the Netherlands to share their views and how their technology contributes to advanced packaging.
09:30 NL 15:30 TW | Introduction |
09:35 NL 15:35 TW | Keynote by Dr. Vincent Lin, Advanced Package Director, ASE Group |
09:45 NL 15:45 TW | Keynote by Mr. Jeroen Duis, Chief Commercial Officer, Phix |
09:55 NL 15:55 TW | Keynote by Mr. Johan Hamelink, Vice-President Business Development, Boschman |
10:05 NL 16:05 TW | Keynote by Mr. Ludo Vandenberk, Executive Vice President, Trymax |
10:15 NL 16:15 TW | Panel discussion & Q&A |
10:30 NL 16:30 TW | End of the webinar |
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September 23 2021
Compound Semiconductor webinar (Closed)
Date | 23 September |
Time | 09:30-11:15 NL time / 15:30 – 17:15 TW time |
Location | Online event |
Program
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July 13 2021
1ste Edition ‘Kick-Off’ The Netherlands & Taiwan Semiconductor Dialogue (Closed)
Event details
Date | 13 July |
Time | 10:00-11:30 NL time / 16:00 – 17:30 TW time |
Location | Online event |
Moderator | Tom van der Dussen, Project Manager Holland Semiconductors |
Program
16:00 | Opening remarks by the Netherlands Office Taipei,
- Guido Tielman, representative Ministry of Economic Affairs of Taiwan & the Ministry of Economic Affairs & Climate of the Netherlands
- Jang-Hwa Leu, Director-General of the Industrial Development Bureau, under the Taiwanese Ministry of Economic Affairs;
- Focco Vijselaar, Director-General, Enterprise & Innovation, Ministry of Economic Affairs & Climate of the Netherlands.
16:10 | Keynote Speakers on the Dutch – Taiwan Semiconductor Supply-Chain and potential future cooperation
- Maria Marced, President Europe, TSMC
- Frits van Hout, former EVP & Chief Strategy Officer of ASML
- Terry Tsao, Global Chief Marketing Officer and President of SEMI Taiwan
- Guy Wittich, Senior Policy Advisor – Semiconductor Industry, Ministry of Economic Affairs & Climate of the Netherlands.
- Roland van Vliet, COO Nearfield Instruments B.V.
16:45 | Discussion
17:15 | Closing remarks and looking ahead on the planned program for the coming months with a series of webinars on topics for cooperation such as:
- Equipment
- Components
- Sustainability
- Finance (access for tech hardware startups)
- Intergrated photonics
- Compound materials
- Advanced packaging
- Other areas